Intel Core i3 Skylake i3-6098P BOX (BX80662I36098P)

micro-ATX, socket Intel LGA 1151, chipset Intel H270, 4 x DDR4, DIMM, 2400 MHz, USB C, HDMI, M.2, > 4 SATA3, CrossFire, no backlight, suitable for mining

micro-ATX, socket Intel LGA 1151, chipset Intel B250, 4 x DDR4, DIMM, 2400 MHz, USB C, HDMI, M.2, > 4 SATA3, CrossFire, suitable for mining

E-ATX, socket Intel LGA 1151, chipset Intel Z270, 4 x DDR4, DIMM, 4000 MHz, USB C, HDMI, DisplayPort, Thunderbolt 3, M.2, U.2, > 4 SATA3, DualBIOS, Wi-Fi, suitable for mining

memory GDDR7, 12 GB, 28000 MHz, NVIDIA GeForce RTX 5070, Blackwell, 2640 MHz, HDMI, DisplayPort, backlight, 16 pin

memory GDDR7, 8 GB, 28000 MHz, NVIDIA GeForce RTX 5060, Blackwell, 2497 MHz, HDMI, DisplayPort, 8 pin, 145 W

memory GDDR7, 16 GB, 28000 MHz, NVIDIA GeForce RTX 5060 Ti, Blackwell, 2602 MHz, HDMI, DisplayPort, 8 pin, 180 W

air cooler, per processor, AMD: AM4, AM5, Intel: 1150, 1155/1156, 1151/1151 v2, 1200, 1700 1851, fan: 2, 135 mm, depth 25 mm, 1700 rpm, maximum TDP 270 W, height: 168 mm, UV glow, backplate mount

air cooler, per processor, AMD: AM4, AM5, Intel: 1150, 1155/1156, 1151/1151 v2, 1200, 1700 1851, fan: 1, 120 mm, depth 25 mm, 2000 rpm, maximum TDP 220 W, height: 152 mm, UV glow, backplate mount

air cooler, per processor, AMD: AM4, AM5, Intel: 1150, 1155/1156, 2066, 1151/1151 v2, 1200, 1700 1851, fan: 1, 120 mm, depth 25 mm, 2100 rpm, maximum TDP 210 W, height: 161 mm, UV glow, backplate mount