Akasa Thermal Compound T5 Pro-Grade Hybrid Silicone & Nano-diamond Particle Thermal Compound Pastes Including Spreader & Wip
 | Expecting restock Socket: |
[ Superior Heat Transmission ] - Use of hybrid silicone and nano diamond micro particles ensures minimal thermal resistance for quick and efficient heat transmission.
[ For CPUs/GPUs and Heatsinks ] - T5 Pro-Grade+ is perfect for high-end systems and overclocking enthusiasts with 10-20 applications.
[ Ultra-Performance ] - Composed of nano-diamond particles for exceptional thermal conductivity. Non-curing paste means no time required to wait for curing process.
[ Easy and Safe Application ] - Easily apply our thermal paste to your CPU and GPU. Non-conductive properties ensures that there is no electrical risk with components.
[ Conveniently Included Wipes and Spreader ] - Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste.
[ For CPUs/GPUs and Heatsinks ] - T5 Pro-Grade+ is perfect for high-end systems and overclocking enthusiasts with 10-20 applications.
[ Ultra-Performance ] - Composed of nano-diamond particles for exceptional thermal conductivity. Non-curing paste means no time required to wait for curing process.
[ Easy and Safe Application ] - Easily apply our thermal paste to your CPU and GPU. Non-conductive properties ensures that there is no electrical risk with components.
[ Conveniently Included Wipes and Spreader ] - Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste.
The product description is generated based on data from online stores. Before purchasing be sure to verify all information directly with the seller.
How to choose a water cooling systemBasic criteria for choosing a water cooling system for stable and safe operation of gaming PCs
How to properly build a PC yourself?Quick course on building computers of varying levels of complexity for beginners and amateurs
We recommendCompare using chart →
liquid cooling, per processor, AMD: AM4, AM5, Intel: 1700 1851, fan: 3, 120 mm, depth 25 mm, 3000 rpm, UV glow, backplate mount
liquid cooling, per processor, AMD: AM4, AM5, Intel: 1150, 1155/1156, 1151/1151 v2, 1200, 1700 1851, fan: 3, 120 mm, depth 25 mm, 2800 rpm, magnetic bearing, backlight, UV glow, backplate mount, display
liquid cooling, per processor, AMD: AM4, AM5, Intel: 1700 1851, fan: 2, 120 mm, depth 25 mm, 2000 rpm, backlight, UV glow, backplate mount
air cooler, per processor, AMD: AM2/AM3/FM1/FM2, AM4, AM5, Intel: 1150, 1155/1156, 2011 v3, 2066, 1151/1151 v2, 1200, 1700 1851, fan: 1, 120 mm, 1500 rpm, maximum TDP 150 W, height: 155 mm, UV glow, backplate mount
liquid cooling, per processor, AMD: AM4, AM5, Intel: 1700 1851, fan: 2, 120 mm, depth 25 mm, 1800 rpm, UV glow, backplate mount
