Comparison ASRock B650M-H/M.2+ vs Asus PRIME B650M-K

The number of processor power phases provided on the motherboard.

Very simplistically, phases can be described as electronic blocks of a special design, through which power is supplied to the processor. The task of such blocks is to optimize this power, in particular, to minimize power surges when the load on the processor changes. In general, the more phases, the lower the load on each of them, the more stable the power supply and the more durable the electronics of the board. And the more powerful the CPU and the more cores it has, the more phases it needs; this number increases even more if the processor is planned to be overclocked. For example, for a conventional quad-core chip, only four phases are often enough, and for an overclocked one, at least eight may be needed. It is because of this that powerful processors can have problems when used on inexpensive low-phase motherboards.

Detailed recommendations on choosing the number of phases for specific CPU series and models can be found in special sources (including the documentation for CPU itself). Here we note that with numerous phases on the motherboard (more than 8), some of them can be virtual. To do this, real electronic blocks are supplemented with doublers or even triplers, which, formally, increases the number of phases: for example, 12 claimed phases can represent 6 physical blocks with doublers. However, virtual phases are much inferior to real ones in terms of capabilities — in fact, t...hey are just additions that slightly improve the characteristics of real phases. So, let's say, in our example, it is more correct to speak not about twelve, but only about six (though improved) phases. These nuances must be specified when choosing a motherboard.

Motherboard dimensions in height and width. It is assumed that the traditional placement of motherboards is vertical, so in this case one of the dimensions is called not the length, but the height.

Motherboard sizes are largely determined by their form factors (see above), however, the size of a particular motherboard may differ slightly from the standard adopted for this form factor. In addition, it is usually easier to clarify the dimensions according to the characteristics of a particular motherboard than to look for or remember general information on the form factor. Therefore, size data can be given even for models that fully comply with the standard.

The third dimension — thickness — is considered less important for a number of reasons, so it is often omitted.

The ability of the motherboard to work with RAM modules that support XMP (Extreme Memory Profiles) technology. This technology was developed by Intel; it is used in motherboards and RAM blocks and only works if both of these system components are XMP compliant. A similar technology from AMD is called AMP.

The main function of XMP is to facilitate system overclocking (“overclocking”): special overclocking profiles are “sewn” into the memory with this technology, and if desired, the user can only select one of these profiles without resorting to complex configuration procedures. This is not only easier, but also safer: every profile added to the bar is tested for stability.

Motherboard-integrated cooling for M.2 SSD drives.

This connector allows you to achieve high speed, however, for the same reason, many M.2 SSDs have high heat dissipation, and additional cooling may be required to avoid overheating. Most often, the simplest radiator in the form of a metal plate is responsible for such cooling — in the case of an SSD, this is quite enough.

The number of USB-C 3.2 gen1 connectors provided on the motherboard.

USB-C connectors (all versions) are used to connect to the "motherboard" USB-C ports located on the outside of the case (usually on the front panel, less often on the top or side). With a special cable, such a port is connected to the connector, while one connector, usually, works with only one port. In other words, the number of connectors on the motherboard corresponds to the maximum number of USB-C chassis connectors that can be used with it.

Recall that USB-C is a relatively new type of USB connector, it is distinguished by its small size and double-sided design; such connectors have their own technical features, so separate connectors must be provided for them. Specifically, USB 3.2 gen1 (formerly known as USB 3.1 gen1 and USB 3.0) provides data transfer speeds of up to 4.8 Gbps. In addition, on a USB-C connector, this version of the connection can support USB Power Delivery technology, which allows you to supply power to external devices up to 100 W; however, this function is not mandatory, its presence in the connectors of one or another "motherboard" should be specified separately.

Connector for connecting an addressable LED strip as a decorative lighting for a computer case. This type of "smart" tape is based on special LEDs, each of which consists of an LED light and a built-in controller, which allows you to flexibly control the luminosity using a special digital protocol and create amazing effects.

Connector for connecting a decorative LED strip and other devices with LED indication. Allows you to control the backlight of the case through the motherboard and customize the glow for your tasks, including synchronize it with other components.

The motherboard has its own D-Sub (VGA) output.

Such an output is intended for transmitting video from an integrated graphics card (see above) or a processor with integrated graphics (we emphasize that it is impossible to output a signal from a discrete graphics card through the motherboard chipset). As for VGA specifically, it is an analogue standard originally created for CRT monitors. It does not differ in image quality, is practically not suitable for resolutions above 1280x1024 and does not provide sound transmission, and therefore is generally considered obsolete. However, this type of input continues to be used in some monitors, TVs, projectors, etc.; so among motherboards you can find models with such outputs.